Interactive Power Devices for Efficiency in Automotive with Increased Reliability and Safety
The main aim of IDEAS project is to develop advanced packaging for power
supply components and new generation memory systems.
A first key objective is the enhancement of the power train platform to ensure the thermal performance and the reliability requirements in particular vs. thermal & power cycles and life time.
The second key objective is to develop a new memory system specifically designed for the agressive requirements of the control systems in advance ICE or Electrically propelled vehicles.
Main constraints will be a very high bandwidth to ensure a fast access for real-time operation with concurent access, both to allow the usage of multi-core processor coping with very high safety requirements and to permit complex software architectures to run on low cost high perfomance microcontroller architectures.
Please, do not hesitate to contact Jiri Kadlec to obtain more information.
|Name:||Interactive Power Devices for Efficiency in Automotive with Increased Reliability and Safety|
|Project No.:||ENIAC JU 304603|
Institute of Microelectronics Applications, Ltd., Czech Rep. (Project coordinator)|
STMicroelectronics, Srl., Italy
Centro Richereche Fiat, Italy
Micron Semiconductors Italia
Poli Model, Srl, Italy
Politecnico di Torino, Italy
Univeristy of Perugia, Italy
University of Roma, Italy
Brno University of Technology, Czech Rep.
Institute of Information Theory and Automation of the CAS, Czech Rep.
Warsaw University of Technology, Poland
Automotive Industry Institute, Poland
DEST Sp.j., Poland
|Duration:||June 1, 2012 - October 31, 2015|
eMMC AXIS Controller Interfacing MTFC32GJWDQ-4M 32 GB Memory on Xilinx KC705 Board
eMMC AXIS Controller Interfacing MTFC32GJWDQ-4M 32 GB Memory on Xilinx ZC702 Board
Interfacing e·MMC 32 GB Memory MTFC32GJWDQ-4M with Xilinx ZC702 FPGA Board
UTIA EdkDSP Platform Demonstrator on Xilinx SP605 Board PLB Bus