Embedded storage elements on next MCU generation ready for AI on the edge

The main objective of the storAIge project is the development and industrialization of FDSOI 28nm and next generation embedded Phase Change Memory (ePCM) world-class semiconductor technologies, allowing the prototyping of high performance, Ultra low power and secured & safety System on Chip (SoC) solutions enabling competitive Artificial Intelligence (AI) for Edge applications.

The main challenge addressed by the project is on one hand to handle the complexity of sub-28nm 'more than moore' technologies and to bring them up at a high maturity level and on the other hand to handle the design of complex SoCs for more intelligent, secure, flexible, low power consumption and cost effective. The project is targeting chipset and solutions with very efficient memories and high computing power targeting 10 Tops per Watt.

The development of the most advanced automotive microcontrollers in FDSOI 28nm ePCM will be the support technology to demonstrate the high performances path as well as the robustness of the ePCM solution. The next generation of FDSOI ePCM will be main path for general purpose advanced microcontrollers usable for large volume Edge AI application in industrial and consumer markets with the best compromise on three requirements: performances, low power and adequate security.

Please, do not hesitate to contact Jiri Kadlec for more information.

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Acronym: StorAIge
Title: Embedded storage elements on next MCU generation ready for AI on the edge
Project No.: ECSEL 101007321
MSMT 8A21009
Call: H2020-ECSEL-2020-1-IA-two-stage
  • STMicroelectronics Crolles 2 SAS, France (coordinator)
  • Commissariat a l'Energie Atomique et aux Energies Alternatives (CEA), France
  • IMEC, Belgium
  • CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement, Switzerland
  • Cybertron Tech GmbH, Switzerland
  • Institute of Microelectronic Applications, Czech Rep.
  • Institute of Information Theory and Automation of the CAS, Czech Rep.
  • Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e. V. (FhG - IPMS), Germany
  • X-FAB Dresden GmbH & Co. KG, Germany
  • Technische Universität Darmstadt, Germany
  • IMMS Institut für Mikroelektronik - und Mechatronik-Systeme gemeinnützige GmbH , Germany
  • EDC Electronic Design Chemnitz GmbH, Germany
  • Micro-Sensys GmbH, Germany
  • Knowtion UG (haftungsbeschränkt), Germany
  • endiio Engineering GmbH, Germany
  • emmtrix Technologies GmbH, Germany
  • STMicroelectronics Rousset SAS, France
  • STMicroelectronics Grenoble 2 SAS, France
  • STMicroelectronics Grand Ouest SAS, France
  • CRNS, Laboratoire des Technologies de la Microelectronique, France
  • Thales Dis France SA, France
  • Université Grenoble-Alpes, France
  • Université d'Aix-Marseille, France
  • Pfeiffer Vacuum, France
  • STMicroelectronics Srl, Italy
  • Politecnico di Torino, Italy
  • Consorzio Nazionale Interuniversitario Per La Nanoelettronica, Italy
  • Wexcellcia AB, Sweden
  • Kungliga Tekniska högskolan (KTH), Sweden
  • Uppsala universitet, Sweden
  • Atlas Copco Industrial Technique AB, Sweden
  • Türkiye Bilimsel ve Teknolojik Araştirma Kurumu (TŰBITAK), Turkey
  • Ford Otomotiv Sanayi A.Ş., Turkey
  • Smart Iş Makinalari San. Tic. A.Ş., Turkey
  • TURKCELL Teknoloji Araştirma ve Geliştirme A.Ş., Turkey
  • Büyütech Yazilim Bilişim Savunma Elektronik Danişmanlik Araştirma Geliştirme Sanayi ve Ticaret Limited Şirketi, Turkey
  • ARCELIK A.Ş., Turkey
  • Istanbul Medipol Űniversitesi Vakfi, Turkey
  • ZF Friedrichshafen AG, Germany
  • X-FAB Global Services GmbH, Germany
  • MELEXIS Erfurt GmbH, Germany
Duration: 1 July 2021 - 31 October 2024