Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors
The WAKeMeUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains.
The project will target the industrialisation of the embedded Phase Change Memory (ePCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM will be driven by the final application requirements as well as decreasing the power consumption.
The already defined microcontrollers with 40nm embedded flash technology will be consolidated to build a solid manufacturing platform. Additional developments will be performed for the integration of memory, power management, connectivity, strong security on the same chip.
The alternative memory solutions will be also studied as they have different - and complementary - traits in such areas as read/write speed, power and energy consumption, retention and endurance, and device density and benchmarked with the ePCM and the conventional eFlash. Continued advances in materials, device physics, architectures and design could further reduce the energy consumption of these memories.
In the project, new devices and systems will be developed by the application partners in automotive and secure, based on FD-SOI and embedded digital technology, answering specific applications needs (power/performance/costs).
Please, do not hesitate to contact Jiri Kadlec for more information.
Terminal demonstrator with STM32H7 and ZU03CG device
(video presentation 35 sec.)
Field Oriented Control (FOC) of BL-DC motor on Trenz Electronic TE0720-03-2IF module with TEC0053-04 power PCB
(presented during EW 2019 at the TRENZ Electronics company booth)
|Title:||Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors|
|Project No.:||783176 (ECSEL)|
|Duration:||1 May 2018 - 31 August 2021|