THIN but Great Silicon 2 Design Objects

THINGS2DO is the ENIAC KET Pilot Line project addresses subprogram 3. Energy Efficiency, 6. Design technologies and 4. Health and Ageing Socity.

THINGS2DO project is focused on building the Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely positioned to take advantage of some very distinct strengths of the European Semiconductor Industry. The baseline 28nm FD-SOI technology is available at an inflection point in the semiconductor progression path and offers unique features at this particular point in time. 14nm-FD-SOI will then take the technology's integration potential to unprecedented levels, utilizing the design/development ecosystem developed here.

Please, do not hesitate to contact Jiri Kadlec for more information.

Project results

Acronym: THINGS2DO
Name: THIN but Great Silicon 2 Design Objects
Project No.: ENIAC JU 621221
MSMT 7H14007
Call: ENIAC-2013-2
  • STMicroelectronics Grenoble, France (project coordinator)
  • STMicroelectronics SA, France
  • CEA LIST French Alternative Energies and Atomic Energy Commission, France
  • CEA LETI French Atomic Energy Commission, France
  • Design & Reuse, France
  • Mentor Graphics, France
  • Atrenta, France
  • Docea Power, France
  • Magillem Design Services, France
  • Asygn, France
  • Circuit Multi Projets, France
  • Cassidian, France
  • Dolphin Integration, France
  • Tiempo, France
  • TIMA Laboratory, France
  • Global Foundries, Germany
  • MunEDA, Germany
  • ZMDI, Germany
  • Ericsson, Turkey
  • Tubitak, Turkey
  • VTT, Finland
  • Warsaw University of Technology, Poland
  • ISD R&D Societe Anonyme S.A., Greece
  • Easii IC, France
  • University Politehnica of Bucharest, Romania
  • Institute of Information Theory and Automation of the CAS, Czech Rep.
  • Institute of Microelectronics, Electromagnetism and Photonics, France
  • Science and Technology Facilities Council, UK
  • METAIO, Germany
  • DxO LAB, France
  • DxO-SIG, France
  • Dream Chip Technologies GmbH, Germany
  • EADS Deutschland GmbH, Germany
  • EADS France, France
  • Institute of Microelectronic Applications, Czech Rep.
  • Institut National de l'Information Geographique et Forestiere, France
  • Instituto de Telecomunicaoes, Portugal
  • Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS, Germany
  • Fraunhofer Research Institution for Modular Solid-State Technologies EMFT, Germany
  • University of Tuebingen, Germany
  • Cadence, Germany
  • SORIN, France
  • M3 system, France
  • NXP Semiconductors, Belgium
  • IMS Bordeaux, France
Duration: 1 January 2014 - 30 June 2018