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THINGS2DO
THIN but Great Silicon 2 Design Objects

THINGS2DO is the ENIAC KET Pilot Line project addresses subprogram 3. Energy Efficiency, 6. Design technologies and 4. Health and Ageing Socity.

THINGS2DO project is focused on building the Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely positioned to take advantage of some very distinct strengths of the European Semiconductor Industry. The baseline 28nm FD-SOI technology is available at an inflection point in the semiconductor progression path and offers unique features at this particular point in time. 14nm-FD-SOI will then take the technology's integration potential to unprecedented levels, utilizing the design/development ecosystem developed here.

Please, do not hesitate to contact Jiri Kadlec for more information.

Project results

• SW Defined Floating Point 8xSIMD EdkDSP IP Serving for Adaptive Noise Cancellation

• Video Processing Demonstrator with Full HD Sensor and 8xSIMD EdkDSP Accelerator IP Core

• Zynq Platform with UTIA EdkDSP Accelerator and Toshiba Sensor Video Processing in HW for TE0720-03-2IF SoM on TE0701-05 Carrier

• Xilinx Vivado 2014.4, Xilinx SDK 2014.4, Xilinx AC701 development board

• Internet of Things Building Blocks for Xilinx Artix7 FPGA with UTIA EdkDSP Accelerators. Vivado 2013.4 Designs with SW Demos.

Acronym:	THINGS2DO
Name:	THIN but Great Silicon 2 Design Objects
Project No.:	ENIAC JU 621221 MSMT 7H14007
Call:	ENIAC-2013-2
web:	https://cordis.europa.eu/project/id/621221
Consortium:	STMicroelectronics Grenoble, France (project coordinator) STMicroelectronics SA, France CEA LIST French Alternative Energies and Atomic Energy Commission, France CEA LETI French Atomic Energy Commission, France Design & Reuse, France Mentor Graphics, France Atrenta, France Docea Power, France Magillem Design Services, France Asygn, France Circuit Multi Projets, France Cassidian, France Dolphin Integration, France Tiempo, France TIMA Laboratory, France Global Foundries, Germany MunEDA, Germany ZMDI, Germany Ericsson, Turkey Tubitak, Turkey VTT, Finland Warsaw University of Technology, Poland ISD R&D Societe Anonyme S.A., Greece Easii IC, France University Politehnica of Bucharest, Romania Institute of Information Theory and Automation of the CAS, Czech Rep. Institute of Microelectronics, Electromagnetism and Photonics, France Science and Technology Facilities Council, UK METAIO, Germany DxO LAB, France DxO-SIG, France Dream Chip Technologies GmbH, Germany EADS Deutschland GmbH, Germany EADS France, France Institute of Microelectronic Applications, Czech Rep. Institut National de l'Information Geographique et Forestiere, France Instituto de Telecomunicaoes, Portugal Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS, Germany Fraunhofer Research Institution for Modular Solid-State Technologies EMFT, Germany University of Tuebingen, Germany Cadence, Germany SORIN, France M3 system, France NXP Semiconductors, Belgium IMS Bordeaux, France
Duration:	1 January 2014 - 30 June 2018

Presentations

• UTIA & IMA in Things2Do project
• High Level Flow for Design and Evaluation of Reconfigurable HW Models of FDSOI IPs