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StorAIge
Embedded storage elements on next MCU generation ready for AI on the edge

The main objective of the storAIge project is the development and industrialization of FDSOI 28nm and next generation embedded Phase Change Memory (ePCM) world-class semiconductor technologies, allowing the prototyping of high performance, Ultra low power and secured & safety System on Chip (SoC) solutions enabling competitive Artificial Intelligence (AI) for Edge applications.

The main challenge addressed by the project is on one hand to handle the complexity of sub-28nm 'more than moore' technologies and to bring them up at a high maturity level and on the other hand to handle the design of complex SoCs for more intelligent, secure, flexible, low power consumption and cost effective. The project is targeting chipset and solutions with very efficient memories and high computing power targeting 10 Tops per Watt.

The development of the most advanced automotive microcontrollers in FDSOI 28nm ePCM will be the support technology to demonstrate the high performances path as well as the robustness of the ePCM solution. The next generation of FDSOI ePCM will be main path for general purpose advanced microcontrollers usable for large volume Edge AI application in industrial and consumer markets with the best compromise on three requirements: performances, low power and adequate security.

Please, do not hesitate to contact Jiri Kadlec for more information.

Project news

• AI self-trained, ultrasound-based, hand gesture recognition (StorAIge use case developed by UTIA)

• StorAIge presents its PhD students: an interview with Raissa Likhonina

Project results

• Adaptive Lattice Filter on STM32H7 Devices

• Xilinx Vitis AI facedetect Demo on Trenz Electronic TE0820 4EV SoM with TE0701 06 Carrier Board and Avnet HDMI In/Out FMC Card

• Xilinx Vitis AI facedetect and resnet50 Demo on Trenz Electronic TE0802 02 with ZU2CG and 1 GB LPDD4

• Xilinx Vitis AI 'facedetect' and 'resnet50' Demo on Trenz Electronic TE0821-01-2cg-4GB SoM + TE0706-3 Carrier

• Testing all Samples from Xilinx Vitis AI Library 2.0 on Trenz Electronic board TE0808 SoM + TEBF0808 Carrier

• All VART Examples from Xilinx Vitis AI 2.0 for Trenz Electronic board TE0808 SoM + TEBF0808 Carrier

• Xilinx Vitis AI 'facedetect' Demo on Trenz Electronic board TE0808 SoM + TEBF0808 Carrier

• Likhonina, Raissa. Fast Bayesian Algorithms for FPGA Platforms.
  (Prague 2022. Thesis.)

Project presentation

• Poster presentation at DATE 2023 PhD forum on 17 April 2023

• UTIA demonstrators at Embedded World 2023 conference

• EFECS 2022: a success for StorAIge (UTIA demonstrator at StorAIge booth)

• UTIA demonstrators at Embedded World 2022 conference

Acronym:	StorAIge
Title:	Embedded storage elements on next MCU generation ready for AI on the edge
Project No.:	ECSEL 101007321 MSMT 8A21009
Call:	H2020-ECSEL-2020-1-IA-two-stage
web:	https://storaige.eu/
Consortium:	STMicroelectronics Crolles 2 SAS, France (coordinator) Commissariat a l'Energie Atomique et aux Energies Alternatives (CEA), France IMEC, Belgium CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement, Switzerland Cybertron Tech GmbH, Switzerland Institute of Microelectronic Applications, Czech Rep. Institute of Information Theory and Automation of the CAS, Czech Rep. Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e. V. (FhG - IPMS), Germany X-FAB Dresden GmbH & Co. KG, Germany Technische Universität Darmstadt, Germany IMMS Institut für Mikroelektronik - und Mechatronik-Systeme gemeinnützige GmbH , Germany EDC Electronic Design Chemnitz GmbH, Germany Micro-Sensys GmbH, Germany Knowtion UG (haftungsbeschränkt), Germany endiio Engineering GmbH, Germany emmtrix Technologies GmbH, Germany STMicroelectronics Rousset SAS, France STMicroelectronics Grenoble 2 SAS, France STMicroelectronics Grand Ouest SAS, France CRNS, Laboratoire des Technologies de la Microelectronique, France Thales Dis France SA, France Université Grenoble-Alpes, France Université d'Aix-Marseille, France Pfeiffer Vacuum, France STMicroelectronics Srl, Italy Politecnico di Torino, Italy Consorzio Nazionale Interuniversitario Per La Nanoelettronica, Italy Wexcellcia AB, Sweden Kungliga Tekniska högskolan (KTH), Sweden Uppsala universitet, Sweden Atlas Copco Industrial Technique AB, Sweden Türkiye Bilimsel ve Teknolojik Araştirma Kurumu (TŰBITAK), Turkey Ford Otomotiv Sanayi A.Ş., Turkey Smart Iş Makinalari San. Tic. A.Ş., Turkey TURKCELL Teknoloji Araştirma ve Geliştirme A.Ş., Turkey Büyütech Yazilim Bilişim Savunma Elektronik Danişmanlik Araştirma Geliştirme Sanayi ve Ticaret Limited Şirketi, Turkey ARCELIK A.Ş., Turkey Istanbul Medipol Űniversitesi Vakfi, Turkey ZF Friedrichshafen AG, Germany X-FAB Global Services GmbH, Germany MELEXIS Erfurt GmbH, Germany
Duration:	1 July 2021 - 31 October 2024

Presentations

• Lattice Filter as Systolic Array HW IP on Zynq UltraScale+ TE0808 Modules
• Tutorials for Vitis AI 2.0 Applications on Trenz Electronic Modules
• Fast Bayesian Algorithms for FPGA Platforms