SOIL
Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment

The main aim of the SOIL project is to contribute to European sovereignty relying on the achievement of an efficient and resilient ecosystem and a sustainable society by driving excellence and innovation in the implementation of semiconductor manufacturing capacity in Europe.

The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe.

The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology.

SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.

Please, do not hesitate to contact Jiri Kadlec for more information.


Acronym: SOIL
Title: Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment
Project No.: KDT JU 101139785
MSMT 9A24002
Call: HORIZON-KDT-JU-2023-1-IA-Topic-1
web: https://www.soil-project.com/
Consortium:
  1. STMICROELECTRONICS CROLLES 2 SAS, France (coordinator)
  2. STMICROELECTRONICS ROUSSET SAS, France
  3. AED VANTAGE GMBH, Germany
  4. ANTENNEX BV, Netherlands
  5. INSTITUT POLYTECHNIQUE DE BORDEAUX, France
  6. COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (CEA), France
  7. CITROBITS GMBH, Germany
  8. DESIGN AND REUSE, France
  9. FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV, Germany
  10. GREENWAVES TECHNOLOGIES, France
  11. INSTITUT POLYTECHNIQUE DE GRENOBLE, France
  12. ION BEAM SERVICES, France
  13. INSTITUT MIKROELEKTRONICKYCH APLIKACI s.r.o., Czech Rep.
  14. INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM (IMEC), Belgium
  15. IMST GMBH, Germany
  16. ISD LYSEIS OLOKRIROMENON SYSTIMATONANONYMOS ETAIREIA, Greece
  17. ROBERT BOSCH BV, Netherlands
  18. NEWAYS ADVANCED MICROSYSTEMS BV, Netherlands
  19. SIAE MICROELETTRONICA SPA, Italy
  20. SILVACO FRANCE, France
  21. SOITEC SA, France
  22. TECHNISCHE UNIVERSITEIT EINDHOVEN, Netherlands
  23. THALES ALENIA SPACE FRANCE SAS, France
  24. UNIVERSITE CATHOLIQUE DE LOUVAIN, Belgium
  25. UNIVERSITA DELLA CALABRI, Italy
  26. UNIVERSITATEA NATIONALA DE STIINTASI TEHNOLOGIE POLITEHNICA BUCUREST, Romania
  27. USTAV TEORIE INFORMACE A AUTOMATIZACE AV CR, v.v.i., Czech Rep.
  28. STMICROELECTRONICS FRANCE, France
  29. STMICROELECTRONICS GRENOBLE 2 SAS, France
  30. IC-LOGIC GMBH, Germany
  31. ECOLE CENTRALE DE LYON, France
  32. GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Germany
  33. EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH, Switzerland
  34. ARGUS SPACE AG, Switzerland
Duration: 1 June 2024 - 31 May 2027